Thermal-electrical co-design is a critical component of our “Smart System Design” process. For high-performance processors, we not only perform precise CFD (Computational Fluid Dynamics) thermal simulations to predict die junction temperatures and board-level thermal distributions under various operating conditions, but also integrate this with power integrity analysis. This is because power supply noise is closely linked to heat generation. In practice, we provide concrete layout optimization recommendations, such as thermal via array design, heat sink/fan selection and airflow path planning, and even suggest high thermal conductivity PCB materials. We once helped a customer reduce the operating temperature of a critical chip by over 15°C, ensuring long-term operational stability and product lifespan.