The following is the classification and analysis of Bluetooth series chips and related technologies, covering application scenarios such as BLE Beacon, SIG Mesh, BT-Voice and Smart-STB:
Bluetooth chips can be classified by protocol stack and function:
l Classic Bluetooth (BT/BDR/EDR) : Supports audio transfer (such as headphones), file transfer, etc., high power consumption.
l Low Energy Bluetooth (BLE/Bluetooth Smart) : Low energy, intermittent data transfer for IoT devices.
l Dual-mode Bluetooth (BT+BLE) : Supports both classic and low energy modes, suitable for smart homes, wearables, etc.
Features: Based on the BLE broadcast protocol, enable location services (indoor navigation), asset tracking, scenario marketing.
Chip solution:
l Low power consumption, supports Eddystone/iBeacon protocol.
l Long broadcast distance.
Features:
l No pairing required, one-way broadcast data (UUID, Major/Minor).
l Typical applications: shopping mall guide, airport boarding gate alert.
Features: Official Bluetooth Mesh networking protocol, supports multi-node relay, large-scale IoT networks (such as smart lighting, building automation).
Chip solution
l Full protocol stack support.
l Low-power Mesh nodes.
Features:
l Self-organizing network, multi-hop transport, supports 1000+ nodes.
l It compets with Zigbee 3.0 but is more compatible with mobile phones based on the BLE ecosystem.
Features: Classic Bluetooth Audio transmission, supporting HFP/A2DP/LE Audio (LC3 encoding).
Chip solution:
l Supports LE Audio and active noise cancellation (ANC).
l Domestic TWS earphone solution.
l Low-cost smart speaker chips.
Trends:
l LE Audio: A new generation of low-power audio standard, enhancing multi-device synchronization (like hearing AIDS).
Functions: Connect remote controls, speakers, headphones and other peripherals via Bluetooth.
Chip demand:
l Dual-mode Bluetooth: BT (audio remote control) + BLE (distribution network, Beacon advertising).
l Typical solution:
¢ Integrate BT 5.0 for 4K set-top boxes.
¢ Voice remote control is supported.
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